Changming Cui
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
1
Active years
2021–2023
Best venue rank
B
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2023 | ETS | Physical-aware Interconnect Testing and Repairing of Chiplets. | Changming Cui, Tuanhui Xu, Haitao Fu, Junlin Huang |
| 2021 | ETS | A 3DIC interconnect interface test and repair scheme based on Hybrid IEEE1838 Die Wrapper Register and BIST circuit. | Changming Cui, Junlin Huang |