Dean L. Lewis
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
4
Venues
4
Active years
2007–2011
Best venue rank
A*
Where they publish
Papers
4 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2011 | ICCD | Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores. | Dean L. Lewis, Shreepad Panth, Xin Zhao, Sung Kyu Lim, Hsien-Hsin S. Lee |
| 2010 | HPCA | An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth. | Dong Hyuk Woo, Nak Hee Seong, Dean L. Lewis, Hsien-Hsin S. Lee |
| 2009 | ICCAD | Pre-bond testable low-power clock tree design for 3D stacked ICs. | Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung Kyu Lim |
| 2007 | ITC | A scanisland based design enabling prebond testability in die-stacked microprocessors. | Dean L. Lewis, Hsien-Hsin S. Lee |