Doo Kim
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2024–2024
Best venue rank
A
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2024 | ITC | Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests. | Sandeep Kumar Goel, Moiz Khan, Ankita Patidar, Frank Lee, Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, Manish Arora |