Gary L. Woods
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
3
Venues
2
Active years
2011–2013
Best venue rank
A*
Where they publish
Papers
3 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2013 | DAC | High-throughput TSV testing and characterization for 3D integration using thermal mapping. | Kapil Dev, Gary L. Woods, Sherief Reda |
| 2011 | DAC | Improved post-silicon power modeling using AC lock-in techniques. | Abdullah Nazma Nowroz, Gary L. Woods, Sherief Reda |
| 2011 | FIE | Work in progress - Implementing and evaluating efforts to engage interdisciplinary teams to solve real-world design challenges. | Z. Maria Oden, Marcia K. O'Malley, Gary L. Woods, Tracy M. Volz |