Ja Chun Ku
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
7
Venues
6
Active years
2005–2007
Best venue rank
A*
Where they publish
Papers
7 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2007 | ICCAD | A self-adjusting clock tree architecture to cope with temperature variations. | Jieyi Long, Ja Chun Ku, Seda Ogrenci Memik, Yehea I. Ismail |
| 2007 | ISCAS | Attaining Thermal Integrity in Nanometer Chips. | Ja Chun Ku, Yehea I. Ismail |
| 2007 | ISCAS | A Compact and Accurate Temperature-Dependent Model for CMOS Circuit Delay. | Ja Chun Ku, Yehea I. Ismail |
| 2007 | ISLPED | Thermal-aware methodology for repeater insertion in low-power VLSI circuits. | Ja Chun Ku, Yehea I. Ismail |
| 2007 | SC | Variable latency caches for nanoscale processor. | Serkan Ozdemir, Arindam Mallik, Ja Chun Ku, Gokhan Memik, Yehea I. Ismail |
| 2006 | ASPDAC | Area optimization for leakage reduction and thermal stability in nanometer scale technologies. | Ja Chun Ku, Yehea I. Ismail |
| 2005 | MICRO | Thermal Management of On-Chip Caches Through Power Density Minimization. | Ja Chun Ku, Serkan Ozdemir, Gokhan Memik, Yehea I. Ismail |