Jiwoo Pak
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
6
Venues
2
Active years
2011–2015
Best venue rank
B
Where they publish
Papers
6 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2015 | ASPDAC | Electromigration-aware redundant via insertion. | Jiwoo Pak, Bei Yu, David Z. Pan |
| 2013 | ICCAD | Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs. | Jiwoo Pak, Sung Kyu Lim, David Z. Pan |
| 2012 | ASPDAC | Design for manufacturability and reliability for TSV-based 3D ICs. | David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang |
| 2012 | ICCAD | Electromigration-aware routing for 3D ICs with stress-aware EM modeling. | Jiwoo Pak, Sung Kyu Lim, David Z. Pan |
| 2011 | ASPDAC | Robust Clock Tree Synthesis with timing yield optimization for 3D-ICs. | Jae-Seok Yang, Jiwoo Pak, Xin Zhao, Sung Kyu Lim, David Z. Pan |
| 2011 | ICCAD | Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. | Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim |