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Kallol Roy

Publication record assembled from the DBLP archive of ranked conferences.

Papers indexed

1

Venues

1

Active years

2019–2019

Best venue rank

A*

Where they publish

Papers

1 indexed papers, newest first.

YearVenueTitleAuthors
2019DACArchitecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse.Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim