Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse.

Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim

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