King L. Tai
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
4
Venues
3
Active years
1989–2000
Best venue rank
B
Where they publish
Papers
4 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2000 | ASPDAC | System-in-package (SIP): challenges and opportunities. | King L. Tai |
| 2000 | ASPDAC | Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology. | Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai, Yee L. Low, Kevin J. O'Conner, King L. Tai |
| 1999 | VTS | A New Bare Die Test Methodology. | Zao Yang, Kwang-Ting Cheng, King L. Tai |
| 1989 | ICCD | Integrated optoelectronics-to-VLSI packaging technology. | C. G. Lin-Hendel, W. J. Bertram, M. S. Dhanaliwala, R. J. Pimpinella, J. M. Segelken, King L. Tai |