Mingbin Yu
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2014–2014
Best venue rank
A
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2014 | DATE | A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os. | Sih-Sian Wu, Kanwen Wang, Sai Manoj Pudukotai Dinakarrao, Tsung-Yi Ho, Mingbin Yu, Hao Yu |