Mohit Pathak
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
7
Venues
5
Active years
2004–2012
Best venue rank
A*
Where they publish
Papers
7 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2012 | ASPDAC | Design for manufacturability and reliability for TSV-based 3D ICs. | David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang |
| 2012 | DAC | Exploiting die-to-die thermal coupling in 3D IC placement. | Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim |
| 2011 | ICCAD | Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. | Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim |
| 2010 | ICCAD | Through-silicon-via management during 3D physical design: When to add and how many? | Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim |
| 2007 | ICCAD | Thermal-aware Steiner routing for 3D stacked ICs. | Mohit Pathak, Sung Kyu Lim |
| 2007 | ICCD | Placement and routing of RF embedded passive designs in LCP substrate. | Mohit Pathak, Souvik Mukherjee, Madhavan Swaminathan, Ege Engin, Sung Kyu Lim |
| 2004 | DATE | Net and Pin Distribution for 3D Package Global Routing. | Jacob R. Minz, Mohit Pathak, Sung Kyu Lim |