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Paper
Exploiting die-to-die thermal coupling in 3D IC placement.
Krit Athikulwongse
,
Mohit Pathak
,
Sung Kyu Lim
Venue
A*
DAC
Year
2012
Proceedings
DAC
DBLP record
conf/dac/AthikulwongsePL12 ↗
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