| 2013 | ASPDAC | Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. | Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim |
| 2012 | ASPDAC | Design for manufacturability and reliability for TSV-based 3D ICs. | David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang |
| 2012 | DAC | Exploiting die-to-die thermal coupling in 3D IC placement. | Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim |
| 2010 | ASPDAC | Buffered clock tree sizing for skew minimization under power and thermal budgets. | Krit Athikulwongse, Xin Zhao, Sung Kyu Lim |
| 2010 | DAC | TSV stress aware timing analysis with applications to 3D-IC layout optimization. | Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee, Sung Kyu Lim, David Z. Pan |
| 2010 | ICCAD | Stress-driven 3D-IC placement with TSV keep-out zone and regularity study. | Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim |
| 2009 | ICCAD | A study of Through-Silicon-Via impact on the 3D stacked IC layout. | Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim |
| 1997 | FPL | An NTSC and PAL closed caption processor. | Sayan Teerapnyawatt, Krit Athikulwongse |