Rongmei Chen
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
4
Venues
2
Active years
2016–2026
Best venue rank
A
Where they publish
Papers
4 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | DATE | Evaluation of Thermal and Power integrity and its Impact on Performance for 3D Memory-on-Logic CPUs with FSPDN and BSPDN. | Yumeng Wang, Xincheng Liu, Hu Zhou, Linqiu Wang, Haolan Yang, Zhuojun Chen, Zhiyong Zhang, Lianmao Peng, Rongmei Chen |
| 2026 | DATE | ETLA-3D: Equivalent Thin Layer Aggregation based Thermal FEM for Hybrid Bonding F2F 3D ICs. | Chenghan Wang, Zhen Zhuang, Kai Zhu, Darong Huang, Luis Costero, Rongmei Chen, David Atienza, Tsung-Yi Ho |
| 2026 | DATE | Architecture, Design and Technology Co-optimization for 3D ICs with Advanced BSPDN Considering Power & Thermal Integrity Impact. | Hu Zhou, Haolan Yang, Xingcheng Liu, Linqiu Wang, Feifan Xie, Yumeng Wang, Zhuojun Chen, Zhiyong Zhang, Lianmao Peng, Rongmei Chen |
| 2016 | IOLTS | Single-event performance of differential flip-flop designs and hardening implication. | Rongmei Chen, Enxia Zhang, Bharat L. Bhuva |