| 2026 | HPCA | NPUWattch: ML-Based Power, Area, and Timing Modeling for Neural Accelerators. | Sehyeon Kim, Minkwan Kim, Chanho Park, Hanmok Park, Seonghoon Kim, Taigon Song, William J. Song |
| 2026 | ISCAS | A16K: 1.6nm NSFET, FSFET, and CFET Technology Libraries for Chip-Level VLSI Prediction. | Hwiryong Kim, Hanmok Park, Mingyun Sun, Yongjin Kwon, Jiyoon Jung, Gahyeon Kim, Gyeongjin Kim, Sein Kang, Sunmean Kim, Taigon Song |
| 2024 | DATE | Reinforcement Learning-Based Optimization of Back-Side Power Delivery Networks in VLSI Design for IR -Drop Reduction. | Seungmin Woo, Hyunsoo Lee, Yunjeong Shin, MinSeok Han, Yunjeong Go, Jongbeom Kim, Hyundong Lee, Hyunwoo Kim, Taigon Song |
| 2024 | ISCAS | FS2K: A Forksheet FET Technology Library and a Study of VLSI Prediction for 2nm and Beyond. | Yunjeong Shin, Daehyeok Park, Dohun Koh, Dongryul Heo, Jieun Park, Hyundong Lee, Jongbeom Kim, Hyunsoo Lee, Taigon Song |
| 2022 | ISLPED | A Study on Optimizing Pin Accessibility of Standard Cells in the Post-3 nm Node. | Jaehoon Jeong, JongHyun Ko, Taigon Song |
| 2021 | ISCAS | NS3K: A 3nm Nanosheet FET Library for VLSI Prediction in Advanced Nodes. | Taehak Kim, Jaehoon Jeong, Seungmin Woo, Jeonggyu Yang, Hyunwoo Kim, Ahyeon Nam, Changdong Lee, Jinmin Seo, Minji Kim, Siwon Ryu, Yoonju Oh, Taigon Song |
| 2017 | ISLPED | Transistor-level monolithic 3D standard cell layout optimization for full-chip static power integrity. | Bon Woong Ku, Taigon Song, Arthur Nieuwoudt, Sung Kyu Lim |
| 2015 | ICCAD | Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs. | Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim |
| 2015 | ICCAD | Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection. | Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim |
| 2014 | DAC | On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. | Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim |
| 2013 | DAC | Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs. | Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim |
| 2013 | ICCAD | On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. | Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim |
| 2011 | DAC | Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. | Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim |