| 1994 | WACV | Precise visual inspection for LSI wafer patterns using subpixel image alignment. | Takashi Hiroi, Shunji Maeda, Hitoshi Kubota, Kenji Watanabe, Yasuo Nakagawa |
| 1992 | ICPR | Automatic screen-printed circuit pattern inspection using connectivity preserving image reduction and connectivity comparison. | Takanori Ninomiya, Kazushi Yoshimura, Mineo Nomoto, Yasuo Nakagawa |
| 1992 | MVA | Development of Solder Joint Inspection Method Using Air Stimulation Speckle Vibration Detection Method and Fluorescence Detection Method. | Takashi Hiroi, Kazushi Yoshimura, Takanori Ninomiya, Toshimitsu Hamada, Yasuo Nakagawa, Shigeki Mio, Kouichi Karasaki, Hideaki Sasaki |
| 1990 | ICRA | Shape from focus: an effective approach for rough surfaces. | Shree K. Nayar, Yasuo Nakagawa |
| 1990 | MVA | Precise Position Detection of a Mesh-Backed Printing Screen Based on the Smallest Enclosing Circle Detection. | Takanori Ninomiya, Yasuo Nakagawa |
| 1989 | ICRA | Automatic 2 1/2 D shape inspection system for via-hole fillings of green sheets by shadow image analysis. | Takanori Ninomiya, Mineo Nomoto, Yasuo Nakagawa |
| 1988 | MVA | Precise Visual Inspection Algorithm for LSI Wafer Patterns Using Grayscale Image Comparison. | Yukio Matsuyama, Hisafumi Iwata, Hitoshi Kubota, Yasuo Nakagawa |