| 2014 | DATE | On GPU bus power reduction with 3D IC technologies. | Young-Joon Lee, Sung Kyu Lim |
| 2013 | DAC | Power benefit study for ultra-high density transistor-level monolithic 3D ICs. | Young-Joon Lee, Daniel B. Limbrick, Sung Kyu Lim |
| 2012 | COMPSAC | A Load Balancing Scheme for Distributed Simulation Based on Multi-agent System. | Young-Joon Lee, Geon Yong Park, Ho Kuen Song, Hee Yong Youn |
| 2012 | ICCAD | Ultra high density logic designs using transistor-level monolithic 3D integration. | Young-Joon Lee, Patrick Morrow, Sung Kyu Lim |
| 2010 | DAC | TSV stress aware timing analysis with applications to 3D-IC layout optimization. | Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee, Sung Kyu Lim, David Z. Pan |
| 2010 | ICCAD | Through-silicon-via management during 3D physical design: When to add and how many? | Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim |
| 2009 | DATE | Co-design of signal, power, and thermal distribution networks for 3D ICs. | Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad S. Bakir, Yogendra K. Joshi, Andrei G. Fedorov, Sung Kyu Lim |
| 2009 | ICCAD | Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs. | Young-Joon Lee, Rohan Goel, Sung Kyu Lim |