| 2026 | ASPDAC | ThPA: Thermal Simulation for Advanced ICs. | Bo-Wen Chen, Yong-Han Lin, Chien-Yu Lin, Yu-Min Lee |
| 2026 | DATE | FALCON-3D: Full-Chip Analytical Thermal Simulation with Lateral CONvection for 3D-Stacked ICs. | Tsung-Lin Lu, Yu-Min Lee, Pei-Yu Huang, Ching-Hsiang Wang |
| 2023 | ASPDAC | Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration. | Hong-Wen Chiou, Jia-Hao Jiang, Yu-Teng Chang, Yu-Min Lee, Chi-Wen Pan |
| 2020 | DATE | XGBIR: An XGBoost-based IR Drop Predictor for Power Delivery Network. | Chi-Hsien Pao, An-Yu Su, Yu-Min Lee |
| 2019 | ASPDAC | Phone-nomenon: a system-level thermal simulator for handheld devices. | Hong-Wen Chiou, Yu-Min Lee, Shin-Yu Shiau, Chi-Wen Pan, Tai-Yu Chen |
| 2019 | ASPDAC | Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices. | Hsuan-Hsuan Hsiao, Hong-Wen Chiou, Yu-Min Lee |
| 2017 | ASPDAC | Yield-driven redundant power bump assignment for power network robustness. | Yu-Min Lee, Chi-Han Lee, Yan-Cheng Zhu |
| 2017 | ICCAD | Thermal modeling and design on smartphones with heat pipe cooling technique. | Hong-Wen Chiou, Yu-Min Lee, Hsuan-Hsuan Hsiao, Liang-Chia Cheng |
| 2015 | DATE | A TSV noise-aware 3-D placer. | Yu-Min Lee, Chun Chen, JiaXing Song, Kuan-Te Pan |
| 2013 | ASPDAC | I-LUTSim: An iterative look-up table based thermal simulator for 3-D ICs. | Chi-Wen Pan, Yu-Min Lee, Pei-Yu Huang, Chi-Ping Yang, Chang-Tzu Lin, Chia-Hsin Lee, Yung-Fa Chou, Ding-Ming Kwai |
| 2013 | DATE | NUMANA: a hybrid <u>num</u>erical and <u>ana</u>lytical thermal simulator for 3-D ICs. | Yu-Min Lee, Tsung-Heng Wu, Pei-Yu Huang, Chi-Ping Yang |
| 2012 | ASPDAC | On-chip statistical hot-spot estimation using mixed-mesh statistical polynomial expression generating and skew-normal based moment matching techniques. | Pei-Yu Huang, Yu-Min Lee, Chi-Wen Pan |
| 2010 | ASPDAC | A hierarchical bin-based legalizer for standard-cell designs with minimal disturbance. | Yu-Min Lee, Tsung-You Wu, Po-Yi Chiang |
| 2009 | ASPDAC | Stochastic thermal simulation considering spatial correlated within-die process variations. | Pei-Yu Huang, Jia-Hong Wu, Yu-Min Lee |
| 2009 | ASPDAC | Post-routing redundant via insertion with wire spreading capability. | Cheok-Kei Lei, Po-Yi Chiang, Yu-Min Lee |
| 2009 | ASPDAC | A multiple supply voltage based power reduction method in 3-D ICs considering process variations and thermal effects. | Shih-An Yu, Pei-Yu Huang, Yu-Min Lee |
| 2008 | ASPDAC | Full-chip thermal analysis for the early design stage via generalized integral transforms. | Pei-Yu Huang, Chih-Kang Lin, Yu-Min Lee |
| 2006 | ISCAS | Simultaneous area minimization and decaps insertion for power delivery network using adjoint sensitivity analysis with IEKS method. | Pei-Yu Huang, Yu-Min Lee, Jeng-Liang Tsai, Charlie Chung-Ping Chen |
| 2003 | ASPDAC | A hierarchical analysis methodology for chip-level power delivery with realizable model reduction. | Yu-Min Lee, Charlie Chung-Ping Chen |
| 2003 | DATE | The Power Grid Transient Simulation in Linear Time Based on 3D Alternating-Direction-Implicit Method . | Yu-Min Lee, Charlie Chung-Ping Chen |
| 2002 | DAC | HiPRIME: hierarchical and passivity reserved interconnect macromodeling engine for RLKC power delivery. | Yahong Cao, Yu-Min Lee, Tsung-Hao Chen, Charlie Chung-Ping Chen |
| 2001 | ASPDAC | Optimal spacing and capacitance padding for general clock structures. | Yu-Min Lee, Hing Yin Lai, Charlie Chung-Ping Chen |
| 2001 | ICCAD | Power Grid Transient Simulation in Linear Time Based on Transmission-Line-Modeling Alternating-Direction-Implicit Method. | Yu-Min Lee, Charlie Chung-Ping Chen |
| 2001 | ICCD | Linear Time Hierarchical Capacitance Extraction without Multipole Expansion. | Saisanthosh Balakrishnan, Jong Hyuk Park, Hyungsuk Kim, Yu-Min Lee, Charlie Chung-Ping Chen |