Skip to content
cs-conference-ranking
.org
By subfield
By rank
Methodology
⌕
Search 971 venues
Home
/
ASPDAC
/
Paper
Thermal-Aware 3D IC Placement Via Transformation.
Jason Cong
,
Guojie Luo
,
Jie Wei
,
Yan Zhang
Venue
B
ASPDAC
Year
2007
Proceedings
ASP-DAC
DBLP record
conf/aspdac/CongLWZ07 ↗
Browse the full
ASPDAC paper archive
.