Automated solder joint inspection system using optical 3-D image detection.

Yukio Matsuyama, Toshifumi Honda, Hisae Yamamura, Hideaki Sasazawa, Mineo Nomoto, Takanori Ninomiya, Anton Schick, Ludwig Listl, Paul Kllensperger, Dieter Spriegel, Peter Mengel, Richard Schneider

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