| 1996 | MVA | Automated Visual Inspection Algorithm for Solder Joint of Surface Mount Devices Based on Three Dimensional Shape Analysis. | Toshifumi Honda, Yukio Matsuyama, Hisae Yamamura, Hideaki Sasazawa, Takanori Ninomiya, Ludwig Listl, Anton Schick, Richard Schneider |
| 1996 | WACV | Automated solder joint inspection system using optical 3-D image detection. | Yukio Matsuyama, Toshifumi Honda, Hisae Yamamura, Hideaki Sasazawa, Mineo Nomoto, Takanori Ninomiya, Anton Schick, Ludwig Listl, Paul Kllensperger, Dieter Spriegel, Peter Mengel, Richard Schneider |
| 1994 | MVA | Automated Inspection System for Electronic Devices Mounted on Printed Circuit Boards Using Light-Section Method. | Toshifumi Honda, Hisae Yamamura, Syouji Ueda, Minoru Kawabata, Takanori Ninomiya |
| 1992 | ICPR | Automatic screen-printed circuit pattern inspection using connectivity preserving image reduction and connectivity comparison. | Takanori Ninomiya, Kazushi Yoshimura, Mineo Nomoto, Yasuo Nakagawa |
| 1992 | MVA | Development of Solder Joint Inspection Method Using Air Stimulation Speckle Vibration Detection Method and Fluorescence Detection Method. | Takashi Hiroi, Kazushi Yoshimura, Takanori Ninomiya, Toshimitsu Hamada, Yasuo Nakagawa, Shigeki Mio, Kouichi Karasaki, Hideaki Sasaki |
| 1990 | MVA | Precise Position Detection of a Mesh-Backed Printing Screen Based on the Smallest Enclosing Circle Detection. | Takanori Ninomiya, Yasuo Nakagawa |
| 1989 | ICRA | Automatic 2 1/2 D shape inspection system for via-hole fillings of green sheets by shadow image analysis. | Takanori Ninomiya, Mineo Nomoto, Yasuo Nakagawa |