Chi-Chun Yang
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2025–2025
Best venue rank
B
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | ETS | DFT Techniques For Efficient 3D IC Interconnect Test For Chiplet and Multi-Die Package. | Anshuman Chandra, Chi-Chun Yang, Quoc Phan, Martin Keim |