Eric Beyne
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
9
Venues
6
Active years
1995–2023
Best venue rank
A*
Where they publish
Papers
9 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2023 | DATE | NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips. | Xabier Iturbe, Nassim Abderrahmane, Jaume Abella, Sergi Alcaide, Eric Beyne, Henri-Pierre Charles, Christelle Charpin-Nicolle, Lars Chittka, Anglica Dvila, Arne Erdmann, Carles Estrada, Ander Fernndez, Anna Fontanelli, Jos Flich, Gianluca Furano, Alejandro Hernn Gloriani, Erik Isusquiza, Radu Grosu, Carles Hernndez, Daniele Ielmini, David Jackson, Maha Kooli, Nicola Lepri, Bernab Linares-Barranco, Jean-Loup Lachese, Eric Laurent, Menno Lindwer, Frank Linsenmaier, Mikel Lujn, Karel Masark, Nele Mentens, Orlando Moreira, Chinmay Nawghane, Luca Peres, Jean-Philippe Noel, Arash Pourtaherian, Christoph Posch, Peter Priller, Zdenek Prikryl, Felix Resch, Oliver Rhodes, Todor P. Stefanov, Moritz Storring, Michele Taliercio, Rafael Tornero, Marcel D. van de Burgwal, Geert Van der Plas, Elisa Vianello, Pavel Zaykov |
| 2023 | VTS | IP Session on Chiplet: Design, Assembly, and Test. | Bapi Vinnakota, Jaber Derakhshandeh, Eric Beyne, Erik Jan Marinissen, Sreejit Chakravarty |
| 2013 | ASPDAC | Design issues in heterogeneous 3D/2.5D integration. | Dragomir Milojevic, Pol Marchal, Erik Jan Marinissen, Geert Van der Plas, Diederik Verkest, Eric Beyne |
| 2011 | DAC | 3D heterogeneous system integration: application driver for 3D technology development. | Eric Beyne, Pol Marchal, Geert Van der Plas |
| 2011 | DATE | An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations. | Geert Eneman, J. Cho, V. Moroz, Dragomir Milojevic, M. Choi, Kristin De Meyer, Abdelkarim Mercha, Eric Beyne, Thomas Hoffmann, Geert Van der Plas |
| 2007 | VLSID | Tutorial T7A: Advanced IC Packaging. | Eric Beyne |
| 2006 | DATE | Analysis and modeling of power grid transmission lines. | J. Balachandran, Steven Brebels, Geert Carchon, Tomas Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne |
| 1996 | DATE | Design of Test Modules for the Analysis of MCM Interconnects. | Claudio Truzzi, Eric Beyne, Edwin Ringoot |
| 1995 | ICCD | Signal propagation in high-speed MCM circuits. | Claudio Truzzi, Eric Beyne, Edwin Ringoot, J. Peeters |