Min-Jer Wang
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
11
Venues
3
Active years
2012–2025
Best venue rank
A*
Where they publish
Papers
11 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | ITC | Leveraging UCIe Interface for Silicon Health & Reliabiilty of Chiplets in a 3D Stack. | Sandeep Kumar Goel, Ankita Patidar, Stanley John, Frank Lee, Min-Jer Wang, Daniel F. J. Yang, Yervant Zorian, Manish Arora, Firooz Massoudi, Shaan Awasthi, Stelios Balalis, Velmurugan Pathervellaichamy, Bharath Shankaranarayanan, Narasimhalu Raju, Gurgen Harutyunyan, Grigor Tshagharyan, Vahagn Hovakimyan, Arman Karagyozyan, Alvina Manucharyan |
| 2020 | ITC | A Deep Learning-Based Screening Method for Improving the Quality and Reliability of Integrated Passive Devices. | Chien-Hui Chuang, Kuan-Wei Hou, Cheng-Wen Wu, Mincent Lee, Chia-Heng Tsai, Hao Chen, Min-Jer Wang |
| 2019 | ITC | High Quality Test Methodology for Highly Reliable Devices. | Hao Chen, Mincent Lee, Liang-Yen Chen, Min-Jer Wang |
| 2016 | DAC | Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package. | Yu-Chieh Huang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang |
| 2014 | ITC | Wafer Level Chip Scale Package copper pillar probing. | Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang |
| 2014 | ITC | Redundancy architectures for channel-based 3D DRAM yield improvement. | Bing-Yang Lin, Wan-Ting Chiang, Cheng-Wen Wu, Mincent Lee, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang |
| 2014 | VTS | A 4-GHz universal high-frequency on-chip testing platform for IP validation. | Ping-Lin Yang, Cheng-Chung Lin, Ming-Zhang Kuo, Sang-Hoo Dhong, Chien-Min Lin, Kevin Huang, Ching-Nen Peng, Min-Jer Wang |
| 2013 | ITC | Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study. | Sandeep Kumar Goel, Saman Adham, Min-Jer Wang, Ji-Jan Chen, Tze-Chiang Huang, Ashok Mehta, Frank Lee, Vivek Chickermane, Brion L. Keller, Thomas Valind, Subhasish Mukherjee, Navdeep Sood, Jeongho Cho, Hayden Hyungdong Lee, Jungi Choi, Sangdoo Kim |
| 2013 | ITC | Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch. | Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang |
| 2013 | VTS | 3D-IC interconnect test, diagnosis, and repair. | Chun-Chuan Chi, Cheng-Wen Wu, Min-Jer Wang, Hung-Chih Lin |
| 2012 | ITC | A memory yield improvement scheme combining built-in self-repair and error correction codes. | Tze-Hsin Wu, Po-Yuan Chen, Mincent Lee, Bin-Yen Lin, Cheng-Wen Wu, Chen-Hung Tien, Hung-Chih Lin, Hao Chen, Ching-Nen Peng, Min-Jer Wang |