| 2015 | DAC | Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. | Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim |
| 2015 | ICCAD | Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection. | Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim |
| 2014 | DAC | Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. | Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim |
| 2014 | DAC | Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. | Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim |
| 2013 | ASPDAC | High-density integration of functional modules using monolithic 3D-IC technology. | Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim |
| 2012 | ITC | Scan test of die logic in 3D ICs using TSV probing. | Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim |
| 2012 | VTS | Transition delay fault testing of 3D ICs with IR-drop study. | Shreepad Panth, Sung Kyu Lim |
| 2011 | ICCD | Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores. | Dean L. Lewis, Shreepad Panth, Xin Zhao, Sung Kyu Lim, Hsien-Hsin S. Lee |
| 2011 | VTS | Scan chain and power delivery network synthesis for pre-bond test of 3D ICs. | Shreepad Panth, Sung Kyu Lim |