| 2012 | DDECS | Efficient link-level error resilience in 3D NoCs. | Vladimir Pasca, Saif-Ur Rehman, Lorena Anghel, Mounir Benabdenbi |
| 2012 | IOLTS | Through-silicon-via built-in self-repair for aggressive 3D integration. | Michael Nicolaidis, Vladimir Pasca, Lorena Anghel |
| 2011 | ETS | I-BIRAS: Interconnect Built-In Self-Repair and Adaptive Serialization in 3D Integrated Systems. | Michael Nicolaidis, Vladimir Pasca, Lorena Anghel |
| 2010 | DATE | Error resilience of intra-die and inter-die communication with 3D spidergon STNoC. | Vladimir Pasca, Lorena Anghel, Claudia Rusu, Riccardo Locatelli, Massimo Coppola |
| 2010 | DSN | Fault tolerant communication in 3D integrated systems. | Vladimir Pasca, Lorena Anghel, Mounir Benabdenbi |
| 2010 | ETS | Configurable fault-tolerant link for inter-die communication in 3D on-chip networks. | Vladimir Pasca, Lorena Anghel, Claudia Rusu, Mounir Benabdenbi |
| 2010 | IOLTS | Interconnect Built-In Self-Repair and Adaptive-Serialization (I-BIRAS) for 3D integrated systems. | Michael Nicolaidis, Vladimir Pasca, Lorena Anghel |
| 2010 | IOLTS | Configurable serial fault-tolerant link for communication in 3D integrated systems. | Vladimir Pasca, Lorena Anghel, Claudia Rusu, Mounir Benabdenbi |
| 2008 | MOMM | Determining a parallel session attack on a key distribution protocol using a model checker. | Vladimir Pasca, Anca Jurcut, Reiner Dojen, Tom Coffey |