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An image sensor/processor 3D stacked module featuring ThruChip interfaces.

Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura

VenueBASPDAC
Year2017
ProceedingsASP-DAC

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