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AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration.

Yiqi Jing, Meng Wu, Jiaqi Zhou, Yiyang Sun, Yufei Ma, Ru Huang, Tianyu Jia, Le Ye

VenueA*DAC
Year2024
ProceedingsDAC

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