Brandon Noia
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
6
Venues
4
Active years
2009–2013
Best venue rank
A
Where they publish
Papers
6 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2013 | VTS | Post-DfT-insertion retiming for delay recovery on inter-die paths in 3D ICs. | Brandon Noia, Krishnendu Chakrabarty |
| 2012 | ITC | Scan test of die logic in 3D ICs using TSV probing. | Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim |
| 2011 | ITC | Pre-bond probing of TSVs in 3D stacked ICs. | Brandon Noia, Krishnendu Chakrabarty |
| 2010 | ETS | Test-architecture optimization for TSV-based 3D stacked ICs. | Brandon Noia, Sandeep Kumar Goel, Krishnendu Chakrabarty, Erik Jan Marinissen, Jouke Verbree |
| 2010 | ITC | Optimization methods for post-bond die-internal/external testing in 3D stacked ICs. | Brandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen |
| 2009 | ICCD | Test-wrapper optimization for embedded cores in TSV-based three-dimensional SOCs. | Brandon Noia, Krishnendu Chakrabarty, Yuan Xie |