Moiz Khan
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
6
Venues
3
Active years
2023–2026
Best venue rank
A
Where they publish
Papers
6 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | ETS | Encoded Repair Configuration Chains for Die-to-Die Interconnect Test and Repair Language. | Ashish Reddy Bommana, Anshuman Chandra, Moiz Khan |
| 2026 | ETS | A Circular Repair Scheme for 3DIC Die-to-Die Interconnects. | Anshuman Chandra, Moiz Khan, Barbara Dzialowska, Marta Stepniewska |
| 2026 | VTS | Innovative Practices Session: Efficient Multi-Die Test Architecture & Repair Methods. | Tapan J. Chakraborty, Rajesh Pendurkar, Anshuman Chandra, Jennifer Dworak, Moiz Khan, Vinay Kumar Kotha |
| 2024 | ITC | Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests. | Sandeep Kumar Goel, Moiz Khan, Ankita Patidar, Frank Lee, Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, Manish Arora |
| 2024 | ITC | Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard. | Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar |
| 2023 | ITC | A Case Study on IEEE 1838 Compliant Multi-Die 3DIC DFT Implementation. | Anshuman Chandra, Moiz Khan, Ankita Patidar, Fumiaki Takashima, Sandeep Kumar Goel, Bharath Shankaranarayanan, Vuong Nguyen, Vistrita Tyagi, Manish Arora |