| 2026 | VTS | DART: Dynamic Repair for Interconnect Fault Tolerance in Hybrid Bonding. | Partho Bhoumik, Zhichao Chen, Puneet Gupta, Krishnendu Chakrabarty |
| 2026 | VTS | 2.5D/3D Chiplet-based Integration: New Dimensions in Design and Testing. | Ganap A. Tewary, Partho Bhoumik, Pragnya S. Nalla, Yu Cao, Krishnendu Chakrabarty, Jeff Zhang |
| 2026 | VTS | NERT: Network- and Routing-aware Testing of Interconnects in Fanout Wafer-Level Packaging. | Dhruv Thapar, Partho Bhoumik, Arjun Chaudhuri, Krishnendu Chakrabarty |
| 2025 | ASPDAC | The Unlikely Hero: Nonidealities in Analog Photonic Neural Networks as Built-in Adversarial Defenders. | Haotian Lu, Ziang Yin, Partho Bhoumik, Sanmitra Banerjee, Krishnendu Chakrabarty, Jiaqi Gu |
| 2025 | ITC | Fault Modeling and Testing of Chiplet-to-Chiplet Interconnects in Fan-out Wafer-Level Packaging | Partho Bhoumik, Arjun Chaudhuri, Sandeep Kumar Goel, Krishnendu Chakrabarty |
| 2025 | ITC | SMART: Scalable and Modular Architecture for Routing-Aware Testing of Fan-out Wafer-Level Packages | Partho Bhoumik, Dhruv Thapar, Arjun Chaudhuri, Krishnendu Chakrabarty |
| 2025 | VTS | Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging | Partho Bhoumik, Christopher Bailey, Krishnendu Chakrabarty |
| 2024 | VTS | Testing and Fault Diagnosis for Multi-level Resistive Random-Access Memory in Monolithic 3D Integration. | Shao-Chun Hung, Partho Bhoumik, Krishnendu Chakrabarty |