Quoc Phan
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2024–2025
Best venue rank
B
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | ETS | DFT Techniques For Efficient 3D IC Interconnect Test For Chiplet and Multi-Die Package. | Anshuman Chandra, Chi-Chun Yang, Quoc Phan, Martin Keim |
| 2024 | ITC | Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard. | Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar |