| 2023 | McCore: A Holistic Management of High-Performance Heterogeneous Multicores. | Jaewon Kwon, Yongju Lee, Hongju Kal, Minjae Kim, Youngsok Kim, Won Woo Ro |
| 2023 | NoxyGen: A Network-On-Chip RTL Generator and Validation Tool. | Madhur Kumar, Deepank Grover, Tarun Sharma, Sujay Deb |
| 2023 | AuRORA: Virtualized Accelerator Orchestration for Multi-Tenant Workloads. | Seah Kim, Jerry Zhao, Krste Asanovic, Borivoje Nikolic, Yakun Sophia Shao |
| 2023 | How to Kill the Second Bird with One ECC: The Pursuit of Row Hammer Resilient DRAM. | Michael Jaemin Kim, Minbok Wi, Jaehyun Park, Seoyoung Ko, Jaeyoung Choi, Hwayong Nam, Nam Sung Kim, Jung Ho Ahn, Eojin Lee |
| 2023 | Improving Data Reuse in NPU On-chip Memory with Interleaved Gradient Order for DNN Training. | Jungwoo Kim, Seonjin Na, Sanghyeon Lee, Sunho Lee, Jaehyuk Huh |
| 2023 | HARP: Hardware-Based Pseudo-Tiling for Sparse Matrix Multiplication Accelerator. | Jinkwon Kim, Myeongjae Jang, Haejin Nam, Soontae Kim |
| 2023 | Victima: Drastically Increasing Address Translation Reach by Leveraging Underutilized Cache Resources. | Konstantinos Kanellopoulos, Hong Chul Nam, Nisa Bostanci, Rahul Bera, Mohammad Sadrosadati, Rakesh Kumar, Davide Basilio Bartolini, Onur Mutlu |
| 2023 | Utopia: Fast and Efficient Address Translation via Hybrid Restrictive & Flexible Virtual-to-Physical Address Mappings. | Konstantinos Kanellopoulos, Rahul Bera, Kosta Stojiljkovic, F. Nisa Bostanci, Can Firtina, Rachata Ausavarungnirun, Rakesh Kumar, Nastaran Hajinazar, Mohammad Sadrosadati, Nandita Vijaykumar, Onur Mutlu |
| 2023 | AESPA: Asynchronous Execution Scheme to Exploit Bank-Level Parallelism of Processing-in-Memory. | Hongju Kal, Chanyoung Yoo, Won Woo Ro |
| 2023 | Predicting Future-System Reliability with a Component-Level DRAM Fault Model. | Jeageun Jung, Mattan Erez |
| 2023 | ADA-GP: Accelerating DNN Training By Adaptive Gradient Prediction. | Vahid Janfaza, Shantanu Mandal, Farabi Mahmud, Abdullah Muzahid |
| 2023 | DASH-CAM: Dynamic Approximate SearcH Content Addressable Memory for genome classification. | Zuher Jahshan, Itay Merlin, Esteban Garzn, Leonid Yavits |
| 2023 | RM-STC: Row-Merge Dataflow Inspired GPU Sparse Tensor Core for Energy-Efficient Sparse Acceleration. | Guyue Huang, Zhengyang Wang, Po-An Tsai, Chen Zhang, Yufei Ding, Yuan Xie |
| 2023 | CASA: An Energy-Efficient and High-Speed CAM-based SMEM Seeding Accelerator for Genome Alignment. | Yi Huang, Lingkun Kong, Dibei Chen, Zhiyu Chen, Xiangyu Kong, Jianfeng Zhu, Konstantinos Mamouras, Shaojun Wei, Kaiyuan Yang, Leibo Liu |
| 2023 | Simultaneous and Heterogenous Multithreading. | Kuan-Chieh Hsu, Hung-Wei Tseng |
| 2023 | DOSA: Differentiable Model-Based One-Loop Search for DNN Accelerators. | Charles Hong, Qijing Huang, Grace Dinh, Mahesh Subedar, Yakun Sophia Shao |
| 2023 | Si-Kintsugi: Towards Recovering Golden-Like Performance of Defective Many-Core Spatial Architectures for AI. | Edward Hanson, Shiyu Li, Guanglei Zhou, Feng Cheng, Yitu Wang, Rohan Bose, Hai Li, Yiran Chen |
| 2023 | Cambricon-U: A Systolic Random Increment Memory Architecture for Unary Computing. | Hongrui Guo, Yongwei Zhao, Zhangmai Li, Yifan Hao, Chang Liu, Xinkai Song, Xiaqing Li, Zidong Du, Rui Zhang, Qi Guo, Tianshi Chen, Zhiwei Xu |
| 2023 | LogNIC: A High-Level Performance Model for SmartNICs. | Zerui Guo, Jiaxin Lin, Yuebin Bai, Daehyeok Kim, Michael M. Swift, Aditya Akella, Ming Liu |
| 2023 | Uncore Encore: Covert Channels Exploiting Uncore Frequency Scaling. | Yanan Guo, Dingyuan Cao, Xin Xin, Youtao Zhang, Jun Yang |
| 2023 | Eureka: Efficient Tensor Cores for One-sided Unstructured Sparsity in DNN Inference. | Ashish Gondimalla, Mithuna Thottethodi, T. N. Vijaykumar |
| 2023 | Micro-Armed Bandit: Lightweight & Reusable Reinforcement Learning for Microarchitecture Decision-Making. | Gerasimos Gerogiannis, Josep Torrellas |
| 2023 | MEGA Evolving Graph Accelerator. | Chao Gao, Mahbod Afarin, Shafiur Rahman, Nael B. Abu-Ghazaleh, Rajiv Gupta |
| 2023 | MVC: Enabling Fully Coherent Multi-Data-Views through the Memory Hierarchy with Processing in Memory. | Daichi Fujiki |
| 2023 | Heterogeneous Die-to-Die Interfaces: Enabling More Flexible Chiplet Interconnection Systems. | Yinxiao Feng, Dong Xiang, Kaisheng Ma |