Multi-Partner Project: Advancing European Semiconductor and Chiplet Innovation Through the Bavarian Chip Design Center.

Hussam Amrouch, Jehaan Joseph, Michael Schirmer, Johannes Geier, Ulf Schlichtmann, Michael Meidinger, Thomas Wild, Andreas Herkersdorf, Jens Npel, Georg Sigl, Yicheng Zhang, Carsten Trinitis, Aswathy Nedumpalli Sankaranarayanan, Martin Schulz, Andreas Korb, Konrad Hohentanner

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