Hetero-ChipletSim: Bridging Chiplet, Interconnect and Packaging Heterogeneity in Multi-Chiplet System Simulation.
Xuguang Yuan, Jiangyuan Gu, Qidie Wu, Yang Hu, Shaojun Wei, Shouyi Yin
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Xuguang Yuan, Jiangyuan Gu, Qidie Wu, Yang Hu, Shaojun Wei, Shouyi Yin
Browse the full DATE paper archive.