Skip to content
cs-conference-ranking
.org
By subfield
By rank
Methodology
⌕
Search 971 venues
Home
/
ITC
/
Paper
Testing 3D chips containing through-silicon vias.
Erik Jan Marinissen
,
Yervant Zorian
Venue
A
ITC
Year
2009
Proceedings
ITC
DBLP record
conf/itc/MarinissenZ09 ↗
Browse the full
ITC paper archive
.