| 2013 | 3DIC from concept to reality. | Frank Lee, Bill Shen, Willy Chen, Suk Lee |
| 2013 | Deflection routing in 3D Network-on-Chip with TSV serialization. | Jinho Lee, Dongwook Lee, Sunwook Kim, Kiyoung Choi |
| 2013 | Cache Capacity Aware Thread Scheduling for Irregular Memory Access on many-core GPGPUs. | Hsien-Kai Kuo, Ta-Kan Yen, Bo-Cheng Charles Lai, Jing-Yang Jou |
| 2013 | A 25-Gb/s LD driver with area-effective inductor in a 0.18-m CMOS. | Takeshi Kuboki, Yusuke Ohtomo, Akira Tsuchiya, Keiji Kishine, Hidetoshi Onodera |
| 2013 | A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched Transmission Line Couplers and Dicode partial-response channel transceivers. | Atsutake Kosuge, Wataru Mizuhara, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda |
| 2013 | SMYLEref: A reference architecture for manycore-processor SoCs. | Masaaki Kondo, Son Truong Nguyen, Tomoya Hirao, Takeshi Soga, Hiroshi Sasaki, Koji Inoue |
| 2013 | Self-Aligned Double and Quadruple Patterning-aware grid routing with hotspots control. | Chikaaki Kodama, Hirotaka Ichikawa, Koichi Nakayama, Toshiya Kotani, Shigeki Nojima, Shoji Mimotogi, Shinji Miyamoto, Atsushi Takahashi |
| 2013 | Pulsed-latch ASIC synthesis in industrial design flow. | Sangmin Kim, Duckhwan Kim, Youngsoo Shin |
| 2013 | A regulated charge pump with low-power integrated optimum power point tracking algorithm for indoor solar energy harvesting. | Jungmoon Kim, Chulwoo Kim |
| 2013 | Signal integrity modeling and measurement of TSV in 3D IC. | Joohee Kim, Joungho Kim |
| 2013 | A full 4-channel 60 GHz direct-conversion transceiver. | Seitaro Kawai, Ryo Minami, Ahmed Musa, Takahiro Sato, Ning Li, Tatsuya Yamaguchi, Yasuaki Takeuchi, Yuki Tsukui, Kenichi Okada, Akira Matsuzawa |
| 2013 | Formal verification of distributed controllers using Time-Stamped Event Count Automata. | Matthias Kauer, Sebastian Steinhorst, Dip Goswami, Reinhard Schneider, Martin Lukasiewycz, Samarjit Chakraborty |
| 2013 | On potential design impacts of electromigration awareness. | Andrew B. Kahng, Siddhartha Nath, Tajana Rosing |
| 2013 | Multi-mode pipelined MPSoCs for streaming applications. | Haris Javaid, Daniel Witono, Sri Parameswaran |
| 2013 | SMYLE Project: Toward high-performance, low-power computing on manycore-processor SoCs. | Koji Inoue |
| 2013 | High-throughput electron beam direct writing of VIA layers by character projection using character sets based on one-dimensional VIA arrays with area-efficient stencil design. | Rimon Ikeno, Takashi Maruyama, Tetsuya Iizuka, Satoshi Komatsu, Makoto Ikeda, Kunihiro Asada |
| 2013 | 315MHz OOK transceiver with 38-W receiver and 36-W transmitter in 40-nm CMOS. | Shunta Iguchi, Akira Saito, Kentaro Honda, Yun Fei Zheng, Kazunori Watanabe, Takayasu Sakurai, Makoto Takamiya |
| 2013 | WUCC: Joint WCET and Update Conscious Compilation for cyber-physical systems. | Yazhi Huang, Mengying Zhao, Chun Jason Xue |
| 2013 | Stacking signal TSV for thermal dissipation in global routing for 3D IC. | Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang |
| 2013 | BonnCell: Automatic layout of leaf cells. | Stefan Hougardy, Tim Nieberg, Jan Schneider |
| 2013 | Layer minimization in escape routing for staggered-pin-array PCBs. | Yuan-Kai Ho, Xin-Wei Shih, Yao-Wen Chang, Chung-Kuan Cheng |
| 2013 | A 40-nm 144-mW VLSI processor for real-time 60-kWord continuous speech recognition. | Guangji He, Takanobu Sugahara, Tsuyoshi Fujinaga, Yuki Miyamoto, Hiroki Noguchi, Shintaro Izumi, Hiroshi Kawaguchi, Masahiko Yoshimoto |
| 2013 | Thermal management for dependable on-chip systems. | Jrg Henkel, Thomas Ebi, Hussam Amrouch, Heba Khdr |
| 2013 | A dynamic stream link for efficient data flow control in NoC based heterogeneous MPSoC. | Claude Helmstetter, Sylvain Basset, Romain Lemaire, Fabien Clermidy, Pascal Vivet, Michel Langevin, Chuck Pilkington, Pierre G. Paulin, Didier Fuin |
| 2013 | Modeling variability and irreproducibility of nanoelectronic resistive switches for circuit simulation. | Arne Heittmann, Tobias G. Noll |