Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs.

Anthony Agnesina, Moritz Brunion, Alberto Garca Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim

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