| 2026 | ETS | Encoded Repair Configuration Chains for Die-to-Die Interconnect Test and Repair Language. | Ashish Reddy Bommana, Anshuman Chandra, Moiz Khan |
| 2026 | ETS | A Circular Repair Scheme for 3DIC Die-to-Die Interconnects. | Anshuman Chandra, Moiz Khan, Barbara Dzialowska, Marta Stepniewska |
| 2026 | VTS | Innovative Practices Session: Efficient Multi-Die Test Architecture & Repair Methods. | Tapan J. Chakraborty, Rajesh Pendurkar, Anshuman Chandra, Jennifer Dworak, Moiz Khan, Vinay Kumar Kotha |
| 2025 | ETS | Testing Functional Interfaces And Complex PADs Within Multi-Die Packages With IEEE P3405. | Anshuman Chandra, Nir Sever, Martin Keim |
| 2025 | ETS | DFT Techniques For Efficient 3D IC Interconnect Test For Chiplet and Multi-Die Package. | Anshuman Chandra, Chi-Chun Yang, Quoc Phan, Martin Keim |
| 2025 | VTS | Test, Debug, and Repair for Chiplet-Based Designs. | Anshuman Chandra, Esteban Garita-Rodrguez, Pradipta Ghosh |
| 2024 | ETS | New Standard-under-Development for Chiplet Interconnect Test and Repair: IEEE Std P3405. | Erik Jan Marinissen, Adrian Evans, Po-Yao Chuang, Martin Keim, Anshuman Chandra |
| 2024 | ITC | Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard. | Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar |
| 2023 | ITC | A Case Study on IEEE 1838 Compliant Multi-Die 3DIC DFT Implementation. | Anshuman Chandra, Moiz Khan, Ankita Patidar, Fumiaki Takashima, Sandeep Kumar Goel, Bharath Shankaranarayanan, Vuong Nguyen, Vistrita Tyagi, Manish Arora |
| 2013 | VTS | Special session 11B: Hot topic on-chip clocking - Industrial trends. | Anshuman Chandra |
| 2009 | DATE | Scalable Adaptive Scan (SAS). | Anshuman Chandra, Rohit Kapur, Yasunari Kanzawa |
| 2008 | DATE | Low Power Illinois Scan Architecture for Simultaneous Power and Test Data Volume Reduction. | Anshuman Chandra, Felix Ng, Rohit Kapur |
| 2008 | VTS | Bounded Adjacent Fill for Low Capture Power Scan Testing. | Anshuman Chandra, Rohit Kapur |
| 2007 | VTS | Multimode Illinois Scan Architecture for Test Application Time and Test Data Volume Reduction. | Anshuman Chandra, Haihua Yan, Rohit Kapur |
| 2003 | DATE | A Unified Approach for SOC Testing Using Test Data Compression and TAM Optimization. | Vikram Iyengar, Anshuman Chandra, Sharon Schweizer, Krishnendu Chakrabarty |
| 2002 | DAC | Reduction of SOC test data volume, scan power and testing time using alternating run-length codes. | Anshuman Chandra, Krishnendu Chakrabarty |
| 2002 | DATE | Test Resource Partitioning and Reduced Pin-Count Testing Based on Test Data Compression. | Anshuman Chandra, Krishnendu Chakrabarty |
| 2002 | VTS | How Effective are Compression Codes for Reducing Test Data Volume? | Anshuman Chandra, Krishnendu Chakrabarty, Rafael A. Medina |
| 2001 | DAC | Combining Low-Power Scan Testing and Test Data Compression for System-on-a-Chip. | Anshuman Chandra, Krishnendu Chakrabarty |
| 2001 | DATE | Efficient test data compression and decompression for system-on-a-chip using internal scan chains and Golomb coding. | Anshuman Chandra, Krishnendu Chakrabarty |
| 2001 | VTS | Frequency-Directed Run-Length (FDR) Codes with Application to System-on-a-Chip Test Data Compression. | Anshuman Chandra, Krishnendu Chakrabarty |
| 2000 | VTS | Test Data Compression for System-on-a-Chip Using Golomb Codes. | Anshuman Chandra, Krishnendu Chakrabarty |