| 2023 | OPT: Optimal Proposal Transfer for Efficient Yield Optimization for Analog and SRAM Circuits. | Yanfang Liu, Guohao Dai, Yuanqing Cheng, Wang Kang, Wei W. Xing |
| 2023 | Routability-Driven Orientation-Aware Analytical Placement for System in Package. | Jai-Ming Lin, Tsung-Chun Tsai, Rui-Ting Shen |
| 2023 | HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique. | Jai-Ming Lin, Yu-Chien Lin, Hsuan Kung, Wei-Yuan Lin |
| 2023 | Single-Qubit Gates Matter for Optimising Quantum Circuit Depth in Qubit Mapping. | Sanjiang Li, Ky Dan Nguyen, Zachary Clare, Yuan Feng |
| 2023 | Invited Paper: Accelerating Next-G Wireless Communications with FPGA-Based AI Accelerators. | Chunxiao Lin, Muhammad Farhan Azmine, Yang Yi |
| 2023 | Invited Paper: Verilog-to-PyG - A Framework for Graph Learning and Augmentation on RTL Designs. | Yingjie Li, Mingju Liu, Alan Mishchenko, Cunxi Yu |
| 2023 | HyperNode: An Efficient Node Classification Framework Using HyperDimensional Computing. | Haomin Li, Fangxin Liu, Yichi Chen, Li Jiang |
| 2023 | RONet: Scaling GPU System with Silicon Photonic Chiplet. | Chengeng Li, Fan Jiang, Shixi Chen, Xianbin Li, Yinyi Liu, Lin Chen, Xiao Li, Jiang Xu |
| 2023 | Accelerating Polynomial Modular Multiplication with Crossbar-Based Compute-in-Memory. | Mengyuan Li, Haoran Geng, Michael T. Niemier, Xiaobo Sharon Hu |
| 2023 | EffiSyn: Efficient Logic Synthesis with Dynamic Scoring and Pruning. | Xing Li, Lei Chen, Jiantang Zhang, Shuang Wen, Weihua Sheng, Yu Huang, Mingxuan Yuan |
| 2023 | Design and Optimization of Low-Dropout Voltage Regulator Using Relational Graph Neural Network and Reinforcement Learning in Open-Source SKY130 Process. | Zonghao Li, Anthony Chan Carusone |
| 2023 | A Point Transformer Accelerator with Fine-Grained Pipelines and Distribution-Aware Dynamic FPS. | Yaoxiu Lian, Xinhao Yang, Ke Hong, Yu Wang, Guohao Dai, Ningyi Xu |
| 2023 | ARMM: Adaptive Reliability Quantification Model of Microfluidic Designs and its Graph-Transformer-Based Implementation. | Siyuan Liang, Meng Lian, Mengchu Li, Tsun-Ming Tseng, Ulf Schlichtmann, Tsung-Yi Ho |
| 2023 | Invited Paper: CircuitOps: An ML Infrastructure Enabling Generative AI for VLSI Circuit Optimization. | Rongjian Liang, Anthony Agnesina, Geraldo Pradipta, Vidya A. Chhabria, Haoxing Ren |
| 2023 | GRAFT: Graph-Assisted Reinforcement Learning for Automated SSD Firmware Testing. | Yoon Hyeok Lee, Youngmin Oh, Gyohun Jeong, Mingyu Pi, Hyukil Kwon, Hakyoung Lim, Eungchae Kim, Sunghee Lee, Bosun Hwang |
| 2023 | Delay-Matching Routing for Advanced Packages. | Chun-An Lee, Wen-Hao Liu, Gary Lin, Tsung-Yi Ho |
| 2023 | Floorplanning for Embedded Multi-Die Interconnect Bridge Packages. | Chung-Chia Lee, Yao-Wen Chang |
| 2023 | Invited Paper: RapidWright: Unleashing the Full Power of FPGA Technology with Domain-Specific Tooling. | Chris Lavin, Eddie Hung |
| 2023 | PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks. | Subed Lamichhane, Wentian Jin, Liang Chen, Mohammadamir Kavousi, Sheldon X.-D. Tan |
| 2023 | Invited Paper: Algorithm/Hardware Co-Design for Few-Shot Learning at the Edge. | Ann Franchesca Laguna, Mohammad Mehdi Sharifi, Dayane Reis, Liu Liu, Andrew Hennessee, Clayton O'Dell, Ian O'Connor, Michael T. Niemier, X. Sharon Hu |
| 2023 | Invited Paper: Ultra-Efficient Edge AI Using FeFET-based Monolithic 3D Integration. | Shubham Kumar, Yogesh Singh Chauhan, Hussam Amrouch |
| 2023 | Reflections on Trusting TrustHUB. | Christian Krieg |
| 2023 | Thermally-Aware Multi-Core Chiplet Stacking. | Gaurav Kothari, Kanad Ghose |
| 2023 | Design and Technology Co-Optimization for Useful Skew Scheduling on Multi-Bit Flip-Flops. | Suwan Kim, Taewhan Kim |
| 2023 | Local Layout Effect-Aware Static Timing Analysis by use of a New Sensitivity-Based Library. | Juyeon Kim, Changho Han, Cheoljun Bae, Yoobeom Kim, Jae Hoon Kim, Hyungjung Seo |