| 2013 | Self-repair of uncore components in robust system-on-chips: An OpenSPARC T2 case study. | Yanjing Li, Eric Cheng, Samy Makar, Subhasish Mitra |
| 2013 | On the generation of compact test sets. | Amit Kumar, Janusz Rajski, Sudhakar M. Reddy, Chen Wang |
| 2013 | Keynote address tuesday: Challenges in mobile devices: Process, design and manufacturing. | Kwang-Hyun Kim |
| 2013 | Practical methods for extending ATE to 40 and 50Gbps. | David C. Keezer, Carl Edward Gray, Te-Hui Chen, Ashraf Majid |
| 2013 | EDT bandwidth management - Practical scenarios for large SoC designs. | Jakub Janicki, Jerzy Tyszer, Wu-Tung Cheng, Yu Huang, Mark Kassab, Nilanjan Mukherjee, Janusz Rajski, Yan Dong, Grady Giles |
| 2013 | A functional test of 2-GHz/4-GHz RF digital communication device using digital tester. | Kiyotaka Ichiyama, Masahiro Ishida, Kenichi Nagatani, Toshifumi Watanabe |
| 2013 | Fault modeling and diagnosis for nanometric analog circuits. | Ke Huang, Haralampos-G. D. Stratigopoulos, Salvador Mir |
| 2013 | Process monitoring through wafer-level spatial variation decomposition. | Ke Huang, Nathan Kupp, John M. Carulli Jr., Yiorgos Makris |
| 2013 | Delay testing and characterization of post-bond interposer wires in 2.5-D ICs. | Shi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng |
| 2013 | Counterfeit electronics: A rising threat in the semiconductor manufacturing industry. | Ke Huang, John M. Carulli, Yiorgos Makris |
| 2013 | Test data analytics - Exploring spatial and test-item correlations in production test data. | Chun-Kai Hsu, Fan Lin, Kwang-Ting Cheng, Wangyang Zhang, Xin Li, John M. Carulli, Kenneth M. Butler |
| 2013 | Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch. | Sen-Kuei Hsu, Hao Chen, Chung-Han Huang, Der-Jiann Liu, Wei-Hsun Lin, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang |
| 2013 | Adaptive testing - Cost reduction through test pattern sampling. | Matt Grady, Bradley Pepper, Joshua Patch, Michael Degregorio, Phil Nigh |
| 2013 | Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study. | Sandeep Kumar Goel, Saman Adham, Min-Jer Wang, Ji-Jan Chen, Tze-Chiang Huang, Ashok Mehta, Frank Lee, Vivek Chickermane, Brion L. Keller, Thomas Valind, Subhasish Mukherjee, Navdeep Sood, Jeongho Cho, Hayden Hyungdong Lee, Jungi Choi, Sangdoo Kim |
| 2013 | Towards data reliable crossbar-based memristive memories. | Amirali Ghofrani, Miguel Angel Lastras-Montao, Kwang-Ting Cheng |
| 2013 | Performance enhancement of a WCDMA/HSDPA+ receiver via minimizing error vector magnitude. | Wei Gao, Chris Liu |
| 2013 | Representative critical-path selection for aging-induced delay monitoring. | Farshad Firouzi, Fangming Ye, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori |
| 2013 | FPGA-based universal embedded digital instrument. | Joshua Ferry |
| 2013 | Don't forget to lock your SIB: Hiding instruments using P16871. | Jennifer Dworak, Al Crouch, John C. Potter, Adam Zygmontowicz, Micah Thornton |
| 2013 | Uncertainty-aware robust optimization of test-access architectures for 3D stacked ICs. | Sergej Deutsch, Krishnendu Chakrabarty, Erik Jan Marinissen |
| 2013 | BA-BIST: Board test from inside the IC out. | Zoe Conroy, Alfred L. Crouch |
| 2013 | RF MEMS switches for Wide I/O data bus applications. | Michael B. Cohn, Kaosio Saechao, Michael Whitlock, Daniel Brenman, Wallace T. Tang, Robert M. Proie |
| 2013 | Theory, model, and applications of non-Gaussian probability density functions for random jitter/noise with non-white power spectral densities. | Daniel Chow, Masashi Shimanouchi, Mike Peng Li |
| 2013 | Test time reduction with SATOM: Simultaneous AC-DC Test with Orthogonal Multi-excitations. | Degang Chen, Zhongjun Yu, Krunal Maniar, Mojtaba Nowrozi |
| 2013 | Predicting system-level test and in-field customer failures using data mining. | Harry H. Chen, Roger Hsu, PaulYoung Yang, J. J. Shyr |